An updated SEQ V4L that only needs one ribbon connector to an LPC-17 or STM32F4 Core.
Image credit: TK.
Wiring follows the same form as the original SEQ v4L. Each element is shown separately (please ignore the part designators):
D0-D7 are used to scan switch input columns
C0-C7 are selection pulses on 8 “rows”
G0-G7 control LED columns
|IC1||11||D0||digital inputs with pullup to +5V|
|IC2||15||C7||via LINK (C7), else directly connected|
|IC3||15||G7||via 100R resistors|
The circuit is merely a single colour 8*8 BLM (button LED matrix) arranged as a 16*4 with one row of switches left out. Normally a different colour LED will be used to indicate steps. A J8/9 connector carries the SRIO chain for 2* 74HC595 and 1* 74HC165 chips (with coupling capacitors). No current sink transistors are used. The remaining components are diodes on every switch to avoid false triggering, pull up resistors for the DIN inputs and current limiting resistors for LEDs.
|9||10k||0204/7||pull ups go on the left side of the board, plus one extra near the 74HC165|
|8||100R||0204/7||right side of the board, one at the bottom||some control over LED brightness is possible, but current is limited by 74HC595s|
|1||LINK||0204/7||one wire link is required, use a clipped resistor lead|
|3||100n||1206||rear of board near ICs|
|1||74HC165||SOIC16||IC1||to the right of J8/9 viewed from the rear|
|2||74HC595||SOIC16||IC2, IC3||to the left of J8/9 viewed from the rear|
|48||1N4148||next to each switch|
|48||see note below|
|2||2*5 (shrouded)||J8/9, J8/9A; rear of PCB||note the input header J8/9 is located near the centre of the board between IC1 and IC2|
For D6 switches many different colours and even square shapes are possible. Ensure the flattened part of the circular base aligns with the silkscreen legend.
v1.1: first release. Errata: the bottom silkscreen names/values are missing. Please refer to the PCB image. In words, the two 74HC595 chips are next to each other, while the 74HC165 chip is on the right side of J8/9 when viewed from the rear.
Putting the board together is simple. As usual, start with the flattest components and work your way up.
If you haven't soldered SMT before it's best to start here so you have a flat PCB to work with. A good strategy is to tin one of the (corner) pads with solder, then place the part with tweezers before forming a joint. Before continuing with others, ensure the part is correctly aligned by reflowing the single pad as needed. If it takes many tries, be sure not to overheat ICs. After a while the flux will be less effective at wetting the joint and so extra through a flux pen or similar is nice to have on hand.
It's good practice to visually and electrically check for short circuits between pads and remove excess solder with braid when required.
J8/9 connects to J8/9 of a Core module (LPC17 or STM32F4).
This file should be uploaded to an STM32F4 Core
The config file MBSEQ_HW.V4L should be copied to the root of the SD Card used. It can be found on the SVN repository.
At some point these should be made available in the normal MIOS32 download section.
A sessions folder will be created on first use if one doesn't exist. If you're having trouble with the MIDI Input, please open the SESSIONS/DEF_V4L/MBSEQ_C.V4 file and change:
MIDI_BUS_Options 0 0x00
MIDI_BUS_Options 0 0x01
Currently the design is © 2016 antilog devices with all rights reserved; all documentation is CC BY-NC-SA 3.0.