wcore_res-sd
Differences
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wcore_res-sd [2017/09/07 21:24] – [BOM v1.0] latigid_on | wcore_res-sd [2018/12/18 09:36] (current) – [BOM v1.0] latigid_on | ||
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===== BOM v1.0 ===== | ===== BOM v1.0 ===== | ||
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+ | **Please find the current BOM on [[http:// | ||
^Type | ^Type | ||
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^LEDs^^^^^^^^^^ | ^LEDs^^^^^^^^^^ | ||
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^Switch^^^^^^^^^^ | ^Switch^^^^^^^^^^ | ||
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^Sockets^^^^^^^^^^ | ^Sockets^^^^^^^^^^ | ||
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^Hardware^^^^^^^^^^ | ^Hardware^^^^^^^^^^ | ||
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Note first of all that all components go on the bottom side apart from the SMT 2*8 header. Try to align the header as straight and as centred as possible. You may want to test fit with the [[wcore_usb|]] module as the IDC socket fits into a routed edge when the two PCBs are stacked. | Note first of all that all components go on the bottom side apart from the SMT 2*8 header. Try to align the header as straight and as centred as possible. You may want to test fit with the [[wcore_usb|]] module as the IDC socket fits into a routed edge when the two PCBs are stacked. | ||
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+ | Note that if a box header is used, the notch should point towards the outer edge of the PCB (pin 1) | ||
As the SD socket can be a bit heat sensitive I am tempted to suggest the pin header should go on before. This will make the board uneven though and thus harder to put the other parts on. So if the header is soldered after the SD socket, be very careful to not heat the socket up too much. | As the SD socket can be a bit heat sensitive I am tempted to suggest the pin header should go on before. This will make the board uneven though and thus harder to put the other parts on. So if the header is soldered after the SD socket, be very careful to not heat the socket up too much. |
wcore_res-sd.1504819447.txt.gz · Last modified: 2017/09/07 21:24 by latigid_on